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LayChip Joins Hands with DoGain to Launch a New Generation of 100mW 1310nm ELSFP Optical Module Solution

2026.03.20 Author：

In response to this cutting-edge market demand, LayChip and DoGain have joined forces to launch a high-profile ELSFP optical module solution based on 1310nm CW DFB chips. Centered on DoGain’s in-house developed 100mW high-power DFB laser chips, the soluti
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SPV Partners with HYC to Launch Multi-Core MT-FIFO Component Solution Based on 3D Optical Waveguide Technology, Empowering High-Density Optical Interconnect Applications

2026.03.19 Author：

Shenzhen Photonics Valley (SPV) and HYC have strategically partnered to launch a 3D optical waveguide-based Multi-Core MT-FIFO solution. This technology enables high-density, low-loss coupling between silicon photonic chips and multi-core fibers, deliveri
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SPV at OFC 2026: 3D Optical Waveguides and Advanced Packaging in the Spotlight

2026.03.17 Author：

Exhibition time: March 17-19,2026; Venue: Los Angeles Convention Center; Booth number: WEST HALL, #4750
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See you at OFC 2026 (Optical Fiber Communications Conference 2026）

2026.01.04 Author：

March 17-19, 2026. Los Angeles, California, United States Los Angeles Convention Center, WEST HALL This product is on display in the WEST HALL, Booth# : 4750
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Meet Our Advanced Package Solutions at WESEMiBAY 2025 (Booth 2E06)

2025.10.13 Author：

Exhibition:WESEMiBAY 2025; Booth Number:2E06; Time: 2025.10.15-10.17; ADD: Shenzhen Convention and Exhibition Center (Futian)
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Exciting Showcase at CIOE 2023: 3D Waveguide Chip and Glass-Based CPO Photonic Integration Technology Captivates Audiences, Orders Pouring In!

2025.09.15 Author：

Shenzhen Photonics Valley Technologies made a remarkable appearance at the 26th China International Optoelectronic Exposition (CIOE). Our flagship products, the 3D waveguide chip and glass-based CPO (Co-Packaged Optics) technology, attracted significant a
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